Interview with Lana Lazareva, Business Developer, MinDCet<br /> <br /> GaN power devices offer fast switching and high efficiency, but the gate-driver circuitry that controls them must operate ...
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April-1, 2025 — United Microelectronics Corporation (UMC), a leading global semiconductor foundry, today announced the official opening of its new 22nm wafer fabrication facility (fab) in Singapore’s ...
Micron Technology has unveiled Micron Research Labs, a new U.S.-based research organization backed by a planned $10 billion investment over the next decade, as the memory manufacturer increases its ...
Taiwan Semiconductor Manufacturing Company (TSMC) will break ground next month on its most advanced fabrication plant to date, focused on the 1.4-nanometer process node, internally known as A14. The ...
Semiconductor Manufacturing International Corporation (SMIC) delivered a strong second quarter of 2026, with quarterly revenue surpassing $3 billion for the first time, supported by higher wafer ...
IC Insights recently released its new Global Wafer Capacity 2019-2023 report that provides in-depth detail, analyses, and forecasts for IC industry capacity by wafer size, process geometry, region, ...
Kaohsiung, Taiwan – August 13, 2025 — ASE Group (Advanced Semiconductor Engineering), the world’s leading OSAT (Outsourced Semiconductor Assembly and Test) provider, has taken a bold step forward in ...
The global semiconductor industry is undergoing a major transformation, driven by a surge in demand for power-efficient analog and mixed-signal technologies. Against this backdrop, X-FAB has emerged ...
June 2, 2025 – Taiwan Semiconductor Manufacturing Company (TSMC), the world’s leading semiconductor foundry, today announced that it is in advanced discussions to evaluate the feasibility of ...
With the prospects of large 450mm wafers going nowhere, IC manufacturers are increasing efforts to maximize fabrication plants using 300mm and 200mm diameter silicon substrates. The number of 300mm ...
Process Lots (or corner lots) are special-modified-wafers that help verifying chip design robustness to accommodate process variations that statistically occur in wafer production over the years. One ...
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