OpenAI revealed first benchmarks for its Jalapeño ASIC, showing up to 1.9× perf/W gains over existing hardware for LLM ...

Qualcomm’s Modular buyout targets cross-chip portability across Nvidia, AMD, and its own AI hardware to break the software ...

MIT uses laser pulses and ultrafast X-rays to map microscopic heat flow in multilayer semiconductors, exposing hidden defect ...

Technical discussions of EV on-board chargers usually focus on the high-power conversion stage: SiC versus GaN, bidirectional topologies, power density, and high-voltage battery architectures. Those ...

I’m a big believer in the “law of unintended consequences,” and I have found that there are at least three of variations of this law: Unintended, unforeseen consequences that are inconsequential or ...

The global memory and NAND flash market has entered a full-fledged super-cycle. What has been looming for years will become painfully real in 2026: allocation pressure for both NAND and DRAM has never ...

—Last in a three-part series. Read part one here and part two here. Traditional chip developers spend billions on R&D, and their budgets are rising—largely attributed to increased costs of chip ...

Industry 4.0 has been a central theme in electronics manufacturing for more than a decade. Yet many organizations still perceive it as a collection of buzzwords, automation, robotics, smart factories ...

Broadcom has consolidated its position as the premier architect of customized AI processors by extending its design partnership with Meta, which, according to its CEO Mark Zuckerberg, is laying the ...

Startup chipmakers Celestial and OpenLight will make their first chips as early as this year, with faster photonics and lower power consumption for hyperscaler customers running AI data centers like ...

The PCIe protocol is getting more complex as it matures, and with 6.0 still in the early days of adoption, interoperability is paramount for advanced AI data centers looking to deployment. Broadcom ...

Analog Devices (ADI) and Microsoft have teamed up to produce time-of-flight (ToF) 3D imaging solutions with the goal of providing greater accuracy regardless of scene conditions. ADI will leverage ...