SUSE targets sovereign AI via architectural choice, enabling enterprises to pivot between Nvidia and AMD silicon without ...

Solving High-Current Connectivity Challenges in Data Centre Cooling As data centre power densities increase, cooling ...

New cooling technologies are emerging as electric drivetrains, AI processors, and autonomous systems push automotive heat ...

OpenAI revealed first benchmarks for its Jalapeño ASIC, showing up to 1.9× perf/W gains over existing hardware for LLM ...

MIT uses laser pulses and ultrafast X-rays to map microscopic heat flow in multilayer semiconductors, exposing hidden defect ...

NVMe 2.4 updates 11 base specs, adding post-quantum cryptography, advanced power monitoring, and subsystem migration for AI ...

Agentic AI is reshaping semiconductor engineering. Much of the industry’s attention has focused on AI’s ability to generate RTL, automate coding tasks, or improve verification coverage. Those are ...

In Part 1 of this series, we discussed HBM4 memory, which is set to deliver unprecedented bandwidth due to its 2,048-bit interface and high data transfer rates. But for applications that need even ...

Many companies are still unfamiliar with the EU Cyber Resilience Act (CRA), and even among those that are aware of it, there are significant misconceptions about both its scope and the amount of work ...

AI chip startup Taalas, co-founded by Tenstorrent co-founder and former CEO and CTO Ljubisa Bajic, is demonstrating its first chip with extraordinary performance. Taalas’ HC1 can achieve more than ...

Hyderabad, India–based Advanced System in Package (ASIP) Technologies has begun construction of an outsourced semiconductor assembly and test (OSAT) facility in Visakhapatnam, Andhra Pradesh, with ...