The future of AI chips is increasingly being shaped by packaging // With its HiPIMS product line, TRUMPF is addressing a key challenge facing the semiconductor industry: the reliable coating of highly ...

Next-gen computing is transforming how advanced technologies process information, solve complex challenges, and drive innovation.

The Nigeria Sovereign Investment Authority (NSIA) is stepping up its technology investments with a plan to develop a ...

Accelerating commercial momentum—highlighted by IonQ’s record $80 million Q2 2026 revenue performance, D-Wave’s 1,120% bookings growth, and expanded cloud quantum deployments across Alphabet (Google) ...

As transistor scaling becomes more difficult and costly, advanced packaging has become one of the most important paths for extending Moore's Law. Technologies such as 2.5D integration, 3D ICs, ...

To commercialize quantum computing, manufacturers need high-quality superconducting materials for microchips, but they also require a reliable, sustainable nanofabrication process. Tantalum is a ...

Local AI hardware requirements depend heavily on memory bandwidth, not just raw compute. See why Apple's 512GB Mac Studio ...

Stratos Lab, Ecoblox and Digital Parks Africa partner to deploy an AI cloud infrastructure platform that is expected to ...

Chipmakers are turning to glass substrates for AI packages, enabling larger and denser arrangements of chiplets and ...

The quantum frontier is rapidly advancing with breakthroughs in logical qubits and error correction moving technology from ...

The Spirit of St. Louis Innovation Center has backing from tech behemoths of NVIDIA, AWS, Google, World Wide Technology, and ...

A US chip restriction jolted India into developing an AI chip that could give the country a sovereign alternative to Nvidia.