2026年7月28日16時27分、熊本県熊本地方でマグニチュード7.1（暫定値）、最大震度7の地震が発生し、気象庁は「令和8年熊本地震」と命名した。菊陽町は震度5強だった。TSMC子会社のJASMは熊本 ...
微軟（Microsoft）計劃最快在今年 9 月發布下一代自研 AI 晶片 Maia 300，並已向台積電（TSMC）確保逾三十萬顆的製造產能，目標在 2027 年完成交付。回顧微軟自研 AI 晶片計畫經歷 Maia 200 的蹣跚起步，如今有望吹響規模化號角。然而面對 Google 明年高達三億顆 TPU 的龐大產量目標，微軟能否在自研晶片賽 ...
Customers shop at the Fifth Avenue Apple Store on new product launch day on September 19, 2025 in New York City. Michael M. Santiago/Getty Images Taiwan Semiconductor Manufacturing Company is holding ...
A current expansion shape-shifting the land outside Anthem surely would impress Julius Caesar, who was something of a write-as-you-fight conqueror. Perhaps predicting modern-day press conferences, ...
日本熊本地震已致 38 人身亡。台積電宣布捐贈 2.5 億日圓協助賑災，旗下 JASM 晶圓廠已全面復原，二廠工程也順利重啟，並發起內部員工募款。
TSMC is reportedly developing a new advanced chip-packaging technology modeled on Intel's Embedded Multi-die Interconnect Bridge (EMIB), signaling that competition in AI semiconductor packaging is ...
The name said everything. When engineers at Taiwan Semiconductor Manufacturing Co. began work on a new advanced chip-packaging technology, they reached for a competitor's vocabulary to describe it.
Taiwan Semiconductor Manufacturing (TSM) is working on a new advanced chip-packaging technology, which is similar to what Intel (INTC) is using to lure in new clients for its foundry, according to The ...
TSMC is reportedly developing an advanced packaging technology to rival Intel's Embedded Multi-die Interconnect Bridge (EMIB), which the company internally refers to as EMIB-like. According to sources ...
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