Silicon Forest facility to support collaborative innovation with chip makers; first milestone in more than $3B planned ...

Investing over $4 billion in Indiana fab and first 'Made in USA' next-generation HBM mass production in U.S. to begin in H2 ...

As transistor dimensions continue to shrink, though, structural disorder in metals and at metal-semiconductor interfaces increasingly impedes carrier injection and transport. Metals therefore need a ...

First graduating class and fifth signing cohort highlight momentum behind Micron's workforce development partnerships in Virginia.

BTU International, a supplier of advanced thermal processing equipment for the electronics manufacturing and semiconductor industries, announced the availability of an advanced Formic Acid Reflow ...

By harnessing the properties of gallium nitride, EPFL engineers have built a tiny transistor that can handle very high voltage with minimal energy loss, a key requirement for AI data centers, electric ...

Diodes Incorporated today announced the successful completion of its acquisition of ElevATE Semiconductor, Inc., a provider of high-performance integrated circuits for the Automated Test Equipment ...

SEMI, the industry association advancing the global semiconductor and electronics design and manufacturing supply chain, today announced keynotes and program highlights for this year’s SEMICON West .

Continued investments through 2032 will further strengthen the companies' long-standing joint venture and drive meaningful, multi-year flash memory-supply.

Thermo Fisher Scientific Inc. today introduced the Thermo Scientific EMPAD G2 detector, a new detector designed to help researchers see and understand materials in unprecedented detail.

New multi-purpose facility showcases company’s industry-leading semiconductor and SMT inspection and metrology offerings and ...

Qnity Electronics, Inc., a technology solutions leader across the semiconductor value chain, today introduced a scalable materials solution platform that brings together metallization, bumping, ...